BS EN 61191-6-2010 印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准
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【英文标准名称】:Printedboardassemblies-EvaluationcriteriaforvoidsinsolderedjointsofBGAandLGAandmeasurementmethods
【原文标准名称】:印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准
【标准号】:BSEN61191-6-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2010-05-31
【实施或试行日期】:2010-05-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:空腔;定义(术语);电气工程;电驱动装置;电子工程;电子设备及元件;电子装置;评定;测量;测量技术;印制电路;印制电路板;分规范;表面安装设备;焊接的;软钎焊连接;焊接;规范;规范(验收);表面安装;X射线;X射线分析
【英文主题词】:Cavity;Definitions;Electricalengineering;Electrically-operateddevices;Electronicengineering;Electronicequipmentandcomponents;Electronically-operateddevices;Evaluations;Measurement;Measuringtechniques;Printedcircuits;Printed-circuitboards;Sectionalspecification;SMD;Soldered;Solderedjoints;Solderings;Specification;Specification(approval);Surfacemounting;X-ray;X-rayanalysis
【摘要】:ThispartofIEC61191specifiestheevaluationcriteriaforvoidsonthescaleofthethermalcyclelife,andthemeasurementmethodofvoidsusingX-rayobservation.ThispartofIEC61191isapplicabletothevoidsgeneratedinthesolderjointsofBGAandLGAsolderedonaboard.ThispartofIEC61191isnotapplicabletotheBGApackageitselfbeforeitisassembledonaboard.Thisstandardisapplicablealsotodeviceshavingjointsmadebymeltandre-solidification,suchasflipchipdevicesandmulti-chipmodules,inadditiontoBGAandLGA.Thisstandardisnotapplicabletojointswithunder-fillbetweenadeviceandaboard,ortosolderjointswithinadevicepackage.Thisstandardisapplicabletomacrovoidsofthesizesoffrom10μmtoseveralhundredmicrometresgeneratedinasolderedjoint,butisnotapplicabletosmallervoids(typically,planarmicrovoids)withasizeofsmallerthan10μmindiameter.Thisstandardisintendedforevaluationpurposesandisapplicableto?researchstudies,?off-lineproductionprocesscontroland?reliabilityassessmentofassembly
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:42P.;A4
【正文语种】:英语
【原文标准名称】:印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准
【标准号】:BSEN61191-6-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2010-05-31
【实施或试行日期】:2010-05-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:空腔;定义(术语);电气工程;电驱动装置;电子工程;电子设备及元件;电子装置;评定;测量;测量技术;印制电路;印制电路板;分规范;表面安装设备;焊接的;软钎焊连接;焊接;规范;规范(验收);表面安装;X射线;X射线分析
【英文主题词】:Cavity;Definitions;Electricalengineering;Electrically-operateddevices;Electronicengineering;Electronicequipmentandcomponents;Electronically-operateddevices;Evaluations;Measurement;Measuringtechniques;Printedcircuits;Printed-circuitboards;Sectionalspecification;SMD;Soldered;Solderedjoints;Solderings;Specification;Specification(approval);Surfacemounting;X-ray;X-rayanalysis
【摘要】:ThispartofIEC61191specifiestheevaluationcriteriaforvoidsonthescaleofthethermalcyclelife,andthemeasurementmethodofvoidsusingX-rayobservation.ThispartofIEC61191isapplicabletothevoidsgeneratedinthesolderjointsofBGAandLGAsolderedonaboard.ThispartofIEC61191isnotapplicabletotheBGApackageitselfbeforeitisassembledonaboard.Thisstandardisapplicablealsotodeviceshavingjointsmadebymeltandre-solidification,suchasflipchipdevicesandmulti-chipmodules,inadditiontoBGAandLGA.Thisstandardisnotapplicabletojointswithunder-fillbetweenadeviceandaboard,ortosolderjointswithinadevicepackage.Thisstandardisapplicabletomacrovoidsofthesizesoffrom10μmtoseveralhundredmicrometresgeneratedinasolderedjoint,butisnotapplicabletosmallervoids(typically,planarmicrovoids)withasizeofsmallerthan10μmindiameter.Thisstandardisintendedforevaluationpurposesandisapplicableto?researchstudies,?off-lineproductionprocesscontroland?reliabilityassessmentofassembly
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:42P.;A4
【正文语种】:英语
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